R-F705S_33EC_12-75-12(ED) 
品牌： PANASONIC(松下)
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R-F705S_33EC_12-75-12(ED) 型号参数
| 属性 | 参数值 |
|---|---|
| Copper Foil Type | ED |
| Copper Foil Part No. | TP4-S |
| Copper Foil Thickness (µm) | 12 |
| Fiim Thickness (µm) | 75 |
| Total products thickness (µm) | 99 |
| Peel Strength.90°:JIS C 6471.A (mm) | 0.75 |
| Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm) | 0.75 |
| Dimensional Stability.MD:IPC-TM-650.After Etching (%) | 0.021 |
| Dimensional Stability.TD:IPC-TM-650.After Etching (%) | 0.006 |
| Dimensional Stability.MD:IPC-TM-650.Ｅ-0.5/150 (%) | 0.028 |
| Dimensional Stability.TD:IPC-TM-650.Ｅ-0.5/150 (%) | 0.004 |
| Soldering Resistance:JIS C 6471.A (°C) | 310 |
| Soldering Resistance:JIS C 6471.C-96/40/90 (°C) | 290 |
| MIT Test:JIS C 6471.0.38R×4.9N,MD | 22 |
| MIT Test:JIS C 6471.0.38R×4.9N,TD | 16 |
| Tensile Modulus:IPC-TM-650 (GPa) | 4.5 |
| Coefficient of Thermal Expansion.MD:TMA 100℃→250℃， 5℃/min (ppm/K) | 18 |
| Coefficient of Thermal Expansion.TD:TMA 100℃→250℃， 5℃/min (ppm/K) | 18 |
| Dielectric Constant at 10GHz:Cavity resonance.A | 3.3 |
| Dissipation Factor at 10GHz:Cavity resonance.A | 0.002 |
| Insulation resistance:JIS C 6471.A (Ω) | ＞1.0×10^14 |
| Insulation resistance:JIS C 6471.C-96/40/90 (Ω) | ＞1.0×10^14 |
| Water absorption:JIS C 6471.D-24/23 (%) | 0.04 |
| Flammability:UL 94.A+E-168/70 | VTM-0 |
