R-F775_40RB_70-100-70(RA) 
品牌： PANASONIC(松下)
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R-F775_40RB_70-100-70(RA) 型号参数
| 属性 | 参数值 |
|---|---|
| Copper Foil Type | RA |
| Copper Foil Part No. | BHY |
| Copper Foil Thickness (µm) | 70 |
| Fiim Thickness (µm) | 100 |
| Total products thickness (µm) | 240 |
| Peel Strength.90°:JIS C 6471.A (mm) | 2.5 |
| Peel Strength.90°:JIS C 6471.260℃ Solder 5sec (mm) | 2.5 |
| Dimensional Stability.MD:IPC-TM-650.After Etching (%) | -0.0457 |
| Dimensional Stability.TD:IPC-TM-650.After Etching (%) | -0.0254 |
| Dimensional Stability.MD:IPC-TM-650.Ｅ-0.5/150 (%) | -0.0774 |
| Dimensional Stability.TD:IPC-TM-650.Ｅ-0.5/150 (%) | -0.0567 |
| Soldering Resistance:JIS C 6471.A (°C) | 330 |
| Soldering Resistance:JIS C 6471.C-96/40/90 (°C) | 250 |
| Tensile Modulus:IPC-TM-650 (GPa) | 7.1 |
| Coefficient of Thermal Expansion.MD:TMA 100℃→250℃， 5℃/min (ppm/K) | 19.3 |
| Coefficient of Thermal Expansion.TD:TMA 100℃→250℃， 5℃/min (ppm/K) | 17.3 |
| Dielectric Constant at 1MHz:IPC-TM-650 2.5.5.5.A | 3.2 |
| Dielectric Constant at 2GHz:IPC-TM-650 2.5.5.5.A | 3.2 |
| Dissipation Factor at 1MHz:IPC-TM-650 2.5.5.5.A | 0.002 |
| Dissipation Factor at 2GHz:IPC-TM-650 2.5.5.5.A | 0.002 |
| Insulation resistance:JIS C 6471.A (Ω) | ＞1.0×10^14 |
| Insulation resistance:JIS C 6471.C-96/40/90 (Ω) | ＞1.0×10^14 |
| Water absorption.IPC-TM-650:JIS C 6471.D-24/23 (%) | 0.8 |
| Moisture Absorption.IPC-TM-650:C-24/23/50 (%) | 0.7 |
| Tg:DMA.A (°C) | 350 |
| Flammability:UL 94.A+E-168/70 | V-0 |
