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射频和无线  > 
射频和无线模块  > 
用户识别模块(SIM)卡

ST4SI2S0019TPI8T

品牌: ST(意法)
封装: CLASSIC CARDS
系列名: ST4SIM-200S
描述:
GSMA eSIM system-on-chip solution for secure IoT applications
GSMA eSIM system-on-chip solution for secure IoT applications
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生命周期:量产

概述

The ST4SIM-200S is an STMicroelectronics top-class GSMA SIM (eSIM or eUICC) product designed for IoT devices.

It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.

The ST4SIM-200S can manage different MNO profiles while ensuring the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).

The ST4SIM-200S can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).

The ST4SIM-200S provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the ST4SIM-200S integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI, 3GPP, 3GPP2 specifications.

The ST4SIM-200S integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory.

The ST4SIM-200S is based on the ST33G1M2, operating in the -25°C to +85 °C temperature range. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm® SecurCore® SC300™ RISC core.

特性
    • Configurable cellular network connectivity by a trusted partner
    • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
    • Network access applications supported: SIM / USIM / ISIM / CSIM
    • Secure element access control (ARF / PKCS#15)
    • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
  • Configurable cellular network connectivity by a trusted partner
  • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
  • Network access applications supported: SIM / USIM / ISIM / CSIM
  • Secure element access control (ARF / PKCS#15)
  • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
  • Hardware
    • Product available on ST33G1M2
    • ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
    • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
    • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
    • Operating temperature: -25°C to +85°C
    • Common Criteria EAL5+
  • Product available on ST33G1M2
  • ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
  • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
  • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
  • Operating temperature: -25°C to +85°C
  • Common Criteria EAL5+
  • ECOPACK-compliant packages
    • 2FF, 3FF or 4FF plugin card (based on D18 micromodule)
    • Triple cut plugin card (based on D18 micromodule)
  • 2FF, 3FF or 4FF plugin card (based on D18 micromodule)
  • Triple cut plugin card (based on D18 micromodule)
  • Security
    • Symmetric cryptography DES / 3DES / AES
    • Asymmetric cryptography RSA (up to 2048 bits)
    • HTTPS remote management TLS v1.0, v1.1 and v1.2
    • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
    • Authentication algorithm: MILENAGE, TUAK, CAVE
  • Symmetric cryptography DES / 3DES / AES
  • Asymmetric cryptography RSA (up to 2048 bits)
  • HTTPS remote management TLS v1.0, v1.1 and v1.2
  • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
  • Authentication algorithm: MILENAGE, TUAK, CAVE
  • Software standard compliance
    • Java Card v3.0.4 Classic
    • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
    • ETSI, 3GPP and 3GPP2 release 12 (See the ST4SIM-200S datasheet and for further information, contact the local STMicroelectronics sales office)
    • Power saving features (PSM and eDRX) defined by ETSI release 13
  • Java Card v3.0.4 Classic
  • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
  • ETSI, 3GPP and 3GPP2 release 12 (See the ST4SIM-200S datasheet and for further information, contact the local STMicroelectronics sales office)
  • Power saving features (PSM and eDRX) defined by ETSI release 13
  • 概述

    The ST4SIM-200S is an STMicroelectronics top-class GSMA SIM (eSIM or eUICC) product designed for IoT devices.

    It is compliant with the GSM Association (GSMA) remote provisioning specification SGP.02 v3.2.

    The ST4SIM-200S can manage different MNO profiles while ensuring the appropriate security level to all eSIM stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on).

    The ST4SIM-200S can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element).

    The ST4SIM-200S provides a secure and interoperable Java Card environment compliant with Java Card v3.0.4 classic. Moreover, the ST4SIM-200S integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI, 3GPP, 3GPP2 specifications.

    The ST4SIM-200S integrates a dynamic memory management with Java Card garbage collection mechanism optimizing the usage of the memory.

    The ST4SIM-200S is based on the ST33G1M2, operating in the -25°C to +85 °C temperature range. This solution is a tamper-resistant secure element certified by Common Criteria EAL5+, with a powerful 32-bit Arm® SecurCore® SC300™ RISC core.

    特性
    • Configurable cellular network connectivity by a trusted partner
    • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
    • Network access applications supported: SIM / USIM / ISIM / CSIM
    • Secure element access control (ARF / PKCS#15)
    • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
  • Configurable cellular network connectivity by a trusted partner
  • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks
  • Network access applications supported: SIM / USIM / ISIM / CSIM
  • Secure element access control (ARF / PKCS#15)
  • OTA capability over SMS, CAT-TP & HTTPS (including DNS)
  • Hardware
    • Product available on ST33G1M2
    • ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
    • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
    • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
    • Operating temperature: -25°C to +85°C
    • Common Criteria EAL5+
  • Product available on ST33G1M2
  • ST33 product based on a 32-bit Arm® SecurCore® SC300™ RISC core
  • Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V)
  • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
  • Operating temperature: -25°C to +85°C
  • Common Criteria EAL5+
  • ECOPACK-compliant packages
    • 2FF, 3FF or 4FF plugin card (based on D18 micromodule)
    • Triple cut plugin card (based on D18 micromodule)
  • 2FF, 3FF or 4FF plugin card (based on D18 micromodule)
  • Triple cut plugin card (based on D18 micromodule)
  • Security
    • Symmetric cryptography DES / 3DES / AES
    • Asymmetric cryptography RSA (up to 2048 bits)
    • HTTPS remote management TLS v1.0, v1.1 and v1.2
    • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
    • Authentication algorithm: MILENAGE, TUAK, CAVE
  • Symmetric cryptography DES / 3DES / AES
  • Asymmetric cryptography RSA (up to 2048 bits)
  • HTTPS remote management TLS v1.0, v1.1 and v1.2
  • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1
  • Authentication algorithm: MILENAGE, TUAK, CAVE
  • Software standard compliance
    • Java Card v3.0.4 Classic
    • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
    • ETSI, 3GPP and 3GPP2 release 12 (See the ST4SIM-200S datasheet and for further information, contact the local STMicroelectronics sales office)
    • Power saving features (PSM and eDRX) defined by ETSI release 13
  • Java Card v3.0.4 Classic
  • GlobalPlatform® card specification v2.2, including GP amendments A, B, C, D and E
  • ETSI, 3GPP and 3GPP2 release 12 (See the ST4SIM-200S datasheet and for further information, contact the local STMicroelectronics sales office)
  • Power saving features (PSM and eDRX) defined by ETSI release 13
  • 封装参数
    • 属性
      参数值
    • Package
      封装
      主要参数
      CLASSIC CARDS
    技术参数
    • 属性
      参数值
    • TOP(°C)
      工作温度
      主要参数
      -25°C~85°C
      Format
      格式
      主要参数
      2FF(Mini),3FF(Micro),4FF(Nano)
    • Network Technology
      网络技术
      主要参数
      2G,3G,4G LTE IOT
    交易参数
    • 属性
      参数值
    • Lifecycle
      生命周期
      主要参数
      量产
      Lifecycle Risk
      生命周期风险
      主要参数
      低
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