X11SPM-F
品牌: Supermicro(超微)
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特性
- Supports 12V DC power input
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C621 Chipset
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only) - Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
- M.2 NGFF connector
M.2 Interface: PCIe 3.0 x4
Form Factor: 2242, 2280
Key: M-Key - 2 GbE LAN ports
- 12 SATA3 (6Gbps) via C621
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
特性
- Supports 12V DC power input
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C621 Chipset
- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots;
Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only) - Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
- M.2 NGFF connector
M.2 Interface: PCIe 3.0 x4
Form Factor: 2242, 2280
Key: M-Key - 2 GbE LAN ports
- 12 SATA3 (6Gbps) via C621
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
X11SPM-F 型号参数
属性 | 参数值 |
---|---|
Physical Stats_Form Factor | microATX |
Physical Stats_Dimension | 9.6" x 9.6" (24.38cm x 24.38cm) |
Processor_CPU | 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 165W TDP |
Processor_Core | Up to 28 cores |
Processor_Note | BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SPBIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R) |
System Memory_Memory Capacity | 6 DIMM slots,Up to 1.5TB 3DSECC LRDIMM, DDR4-2933MT/s; Up to 1.5TB 3DSECC RDIMM, DDR4-2933MT/s,Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only) |
System Memory_Memory Type | 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS) |
System Memory_DIMM Sizes | LRDIMM: 32GB, 64GB, 128GB,RDIMM: 8GB, 16GB, 32GB, 64GB |
System Memory_Memory Voltage | 1.2V |
System Memory_Error Detection | Corrects single-bit errors |
On-Board Devices_Chipset | Intel® C621 |
On-Board Devices_SATA | Intel® C621 controller for 12 SATA3 (6 Gbps) ports; RAID 0,1,5,10 |
On-Board Devices_IPMI | ASPEED AST2500 |
On-Board Devices_Graphics | 1 ASPEED AST2500 BMC port(s) |
On-Board Devices_Network Controllers | Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512 |
Input / Output_SATA | 12 SATA3 (6Gbps) port(s) |
Input / Output_LAN | 2 1GbE LAN ports |
Input / Output_Video Output | 1 VGA port(s) |
Input / Output_Serial Port | 1 COM,1 COM |
Input / Output_DOM | 2 SATA DOM (Disk on Module) power connector support |
Input / Output_TPM | 1 TPM Header |
Expansion Slots_PCIe | 2 PCIe 3.0 x161 PCIe 3.0 x8 |
Expansion Slots_M.2 | M.2 Interface: PCIe 3.0 x4,Form Factor: 2280, 2242,Key: M-Key |
System BIOS_BIOS Type | AMI UEFI |
System BIOS_BIOS Features | ACPI 6.0,RTC (Real Time Clock) Wakeup,SMBIOS 3.0 or later |
Management_Software | SuperDoctor® 5, NMI, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, IPMI2.0, Watchdog |
Management_Power Configurations | Power-on mode for AC power recovery, ACPI Power Management |
PC Health Monitoring_Voltage | VBAT, Supports system management utility, Monitors CPU voltages, Chassis intrusion header, 3.3V standby, +5V standby, +5V, +3.3V, +12V, +1.8V, 8 -fan status |
PC Health Monitoring_LED | UID/remote UID LED,Suspend static indicator LED,CPU/system overheat LED |
PC Health Monitoring_Temperature | CPU thermal trip support,PECI |
PC Health Monitoring_FAN | 8x 4-pin fan headers (up to 8 fans),System level control,PWM fan speed control,Fan speed control,Overheat LED indication |
PC Health Monitoring_Other Features | WOL, UID, RoHS, M.2 NGFF connector, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, ACPI power management |
Operating Environment_Operating Temperature Range | 0°C - 60°C (32°F - 140°F) |
Operating Environment_Non-Operating Temperature Range | -20°C - 60°C (-4°F - 140°F) |
Operating Environment_Operating Relative Humidity Range | 10% - 85% (non-condensing) |
Operating Environment_Non Operating Relative Humidity Range | 10% - 95% (non-condensing) |