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描述：
Infineon introduces its new top side cooling package SSO10T TSC in combination with its leading edge OptiMOS™ MOSFET technology
Infineon introduces its new top side cooling package SSO10T TSC in combination with its leading edge OptiMOS™ MOSFET technology
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生命周期：量产
概述
This innovative TSC package enables best cooling, high power density optimized system costs
An initial portfolio offering starts with 4 products in OptiMOSTM 6 40V and is extended soon.
RDS (on) max ranges from 1.73 mΩ down to 0.75 mΩ.
SSO10T TSC package is JEDEC listed for open market use and wide 2nd source compatibility.
特性
- Direct cooling path to ECU housing
- Improves Zth by -20% up to -50%
- Improves Rth by -20% up to -50%
- Enables double sided PCB design
- Provides higher application currents
- SSO10T TSC is JEDEC listed
for open market and 2nd source compatibility
- Best Cooling Performance
- Not heat transfer into PCB
- Very compact PCB design
- Reduces system area
- Reduces cooling efforts & costs
(no more vias) - Reduces system costs & design efforts
- High power density & efficiency
应用
- Electric power steering
- Power disconnect switches
- Zone control units
- E-fuse box
- DC/DC
- ABS Braking, e-Booster
- all automotive applications
- BLDC drives in a wide variety
概述
This innovative TSC package enables best cooling, high power density optimized system costs
An initial portfolio offering starts with 4 products in OptiMOSTM 6 40V and is extended soon.
RDS (on) max ranges from 1.73 mΩ down to 0.75 mΩ.
SSO10T TSC package is JEDEC listed for open market use and wide 2nd source compatibility.
特性
- Direct cooling path to ECU housing
- Improves Zth by -20% up to -50%
- Improves Rth by -20% up to -50%
- Enables double sided PCB design
- Provides higher application currents
- SSO10T TSC is JEDEC listed
for open market and 2nd source compatibility
- Best Cooling Performance
- Not heat transfer into PCB
- Very compact PCB design
- Reduces system area
- Reduces cooling efforts & costs
(no more vias) - Reduces system costs & design efforts
- High power density & efficiency
应用
- Electric power steering
- Power disconnect switches
- Zone control units
- E-fuse box
- DC/DC
- ABS Braking, e-Booster
- all automotive applications
- BLDC drives in a wide variety
封装参数
- 属性参数值
- Package封装主要参数PG-LHDS0-10Marking丝印主要参数6A4
技术参数
- 属性参数值
- TOP(°C)工作温度主要参数175.0°CTOP min(°C)最低工作温度主要参数-55℃
- TOP max(°C)最高工作温度主要参数+175℃FET TypeFET 类型主要参数N
- Vdss漏极-源极电压主要参数40VId漏极电流主要参数120A
- V(GS)th栅极-源极阈值电压主要参数2.6VRds(on)@Vgs,Id漏极-源极导通电阻主要参数0.75mΩ
- Qg@Vgs栅极电荷主要参数100nCTechnology技术主要参数OptiMOS™-6
合规参数
- 属性参数值
- AEC-QAEC-Q主要参数是RoHSRoHS指令主要参数是
交易参数
- 属性参数值
- Lifecycle生命周期主要参数量产Lifecycle Risk生命周期风险主要参数低
