3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and bare die and wafer level stacking technology meeting the demand for high reliability,high performance and very small size of today's and tomorrow's electronics. Comparing to other existing 2D traditional solutions,our technology allows gaining a factor of at least 10 on the weight and volume of the components. 3D PLUS standard products and System-ln-Package (SiP) solutions are used in high technology industries for industrial,computer boards&embedded systems,defense&security,aircrafts&avionics,medical&sciences and aerospace applications.